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2018
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C. Baykasoglu, O. Akyildiz, D. Candemir,
Q. Yang, A.C. To
Predicting microstructure evolution during directed energy deposition
additive manufacturing of Ti-6Al-4V.
Journal of
Manufacturing Science and Engineering.
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2017
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O.
Akyildiz and T.O. Ogurtani
Thermal
Grooving by Surface Diffusion: a Review of Classical Thermo-Kinetics Approach.
Hittite J. Sci. Eng., 4, 7-16.
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2016
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A.
Abdellahi, O. Akyildiz, R. Malik, K. Thornton, G. Ceder
The
thermodynamic stability of intermediate solid solutions in LiFePO4
nanoparticles.
J. Mater. Chem. A, 2016,4, 5436-5447.
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2015
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T. O.
Ogurtani and O. Akyildiz
Hillock
formation by elastic dipole interaction energy driven surface drift-diffusion
under compressive stresses in bi-crystalline thin films.
Hittite J. Sci. Eng., 2, 65-76.
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2014
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A. Abdellahi, O. Akyildiz, R. Malik, K. Thornton, G. Ceder
Particle-size
and morphology dependence of the preferred interface orientation in LiFePO4
nano-particles.
J. Mater. Chem. A, 2, 15437-15447.
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2012
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O.
Akyildiz, E. E. Oren and T. O. Ogurtani
Grain
boundary grooving in bi-crystal thin films induced by the surface drift
diffusion driven by capillary forces and applied uniaxial tensile stress.
Philos. Mag., 92, 804-829.
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2011
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O.
Akyildiz, E. E. Oren and T. O. Ogurtani
Mesoscopic
nonequilibrium thermodynamics treatment of the
grain boundary thermal grooving induced by the anisotropic surface drift
diffusion.
J.
Mater. Sci., 46 (18), 6054-6064.
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2011
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O.
Akyildiz, and T. O. Ogurtani
Grain
boundary grooving induced by the anisotropic surface drift diffusion driven
by the capillary and electromig-ration forces: Simulations
J.
Appl. Phys., 110(4), 043521.
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2008
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T. O.
Ogurtani and O. Akyildiz
Morphological
evolution of voids by surface drift-diffusion driven by the capillary, electromigration and thermal-stress gradient induced by
the steady state heat flow in passivated metallic thin films: Part-II
(Applications)
J.
Appl. Phys., 104, 023522.
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2008
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T. O.
Ogurtani and O. Akyildiz
Morphological
evolution of voids by surface drift-diffusion driven by the capillary, electromigration and thermal-stress gradient induced by
the steady state heat flow in passivated metallic thin films: Part-I (Theory)
J.
Appl. Phys., 104, 023521.
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2008
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T. O.
Ogurtani, O. Akyildiz and E. E. Oren
Morphological
evolution of tilted grain-boundary thermal grooving by surface diffusion in bicrystal thin solid films having strong anisotropic
surface Gibbs free energies.
J.
Appl. Phys., 104, 013518.
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2008
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T. O.
Ogurtani and O. Akyildiz
Cathode
edge displacement by voiding coupled with grain boundary grooving in bamboo
like metallic interconnects by surface drift-diffusion under the capillary
and electromigration forces.
Int.
J. Solids Struct., 45 (3-4), 921-942.
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2007
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T. O.
Ogurtani and O. Akyildiz
Morphological
evolution of intragranular voids under the
thermal-stress gradient generated by the steady state heat flow in encapsulated
metallic films: Special reference to flip chip solder joints
Solid State Phenom., 139, 151-156.
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2006
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T. O.
Ogurtani and O. Akyildiz
Computer
simulations on grain boundary grooving and cathode edge displacement in
bamboo-like metallic interconnects
MRS Symp. Proc., 914, 0914-F09-22.
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2005
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T. O.
Ogurtani and O. Akyildiz
Grain
boundary grooving and cathode voiding in bamboo-like metallic interconnects
by surface diffusion under capillary and electromigration
forces
J.
Appl. Phys., 97, 093520.
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